Nakul, FitriyantiSitompul, Stephen2025-01-032024-06-24ASSECThttp://103.209.1.147:4000/handle/PL029/3082Econo pim 3 module is one of the manufactured products that has a good summary of features as highs power density, integrated temperature sensor available and RoHS- compliant module. Econo pim 3 module also has advantages as compact module concept, optimized customers development cycle time and cost, configuration flexibility and econo pim 3 module can be applied to motor control and drives, industrial heating and welding and room air conditioners. But with all that advantages econo pim 3 module must go through a long process, during the manufacturing process the module is found scrap or not suitable to use, from many manufacturing process system soldering process is bottle neck of scrap found. The purpose of this research is to find the root cause of econo pim 3 module defects during system soldering process and to analysis defects that occur. This research uses the fishbone diagram method, which fishbone diagram is certainly carried help full in knowing the cause of the defects occurs. Fishbone diagram, also called as ‘cause-and-effect’ diagram, is a tool used to identify the root cause of problems which represents the effect and the factors or causes influencing it. [1] Keywords: Defects, Pim 3 Module, System Soldering Process, Fishbone diagramenTECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineeringTECHNOLOGY::Electrical engineering, electronics and photonics::ElectronicsSOCIAL SCIENCES::Statistics, computer and systems science::Informatics, computer and systems science::Data processingArticleNIM3222001032NIDN0004049006KODEPRODI005029#TEKNIKELEKTRONIKA MANUFAKTUR