Maulidiah,Hana MutialifFauzan,Muhammad Al2025-01-042024-07-06JAEEhttp://103.209.1.147:4000/handle/PL029/3191The Capillary Bonding process is an important method in the assembly of semiconductor components that involves joining with the use of adhesive materials. The capillary is one of the main components along with the blade contained in a wire bonding machine system. Wire bonding machine system with a process using the HK-133 type which can affect productivity in the bonding process. Productivity in the bonding process. This study aims to analysis the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, namely describe and analysis the problems, The research shows that every calibration and capillary limit that has been replaced will have an impact on good results, as well as increase productivity on the machine framebond HK 133.enTECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineeringTECHNOLOGY::Electrical engineering, electronics and photonics::ElectronicsArticle3222101003KODEPRODI005029#TEKNIK_ELETRONIKA_MANUFAKTUR