Wivanius,NadrahSinaga,Marupa Daniel2025-01-032024-06-14JAEEhttp://103.209.1.147:4000/handle/PL029/3060Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,CapillaryenTECHNOLOGY::Electrical engineering, electronics and photonics::ElectronicsTECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineeringAnalyzing Wire Breakage Failure During Bonding ProcessArticle3222101023KODEPRODI005029#Teknik_Elektronika_manufaktur