Abstract:
In an electronic circuit, a component that can connect to each
other without using a cable on a board acts as the conductor for electrical
current called a PCB (Printed Circuit Board). Implementation of the PCB
by screen printing process uses the LPISM (Liquid Photoimageable
Solder Masks) application which in application for PCB plating by
controlling the amount of solder masks in a single coating using the
appropriate parameters with Design of Experiment (DoE) method. This
method of DoE, aimed at improving quality using the minimum cost.
LPISM will be implemented in Teaching Factory, Politeknik Negeri
Batam to protect PCB lines not connected each other,to give proper
dosage, and to reduce the using solder masks lamination, so laboratory
assistant in Teaching Factory, Politeknik Negeri Batam can produce PCB
using LPISM method with IPC-SM-840C standar or near using
experiment data-24 with thikness of solder masks is 2,5 μ.
