Solder Spatter Defect Analysis

Abstract

The soldering system process is a soldering process where chip components are melted by high temperature hot air to form a reflow temperature change process, thus forming a module which is then cooled together. During the soldering process, some scrap often occurs, one of which is solder spatter. The aim of this final assignment is to analyze how often solder spatter occurs on products. In this research I used the flow chart, data collection to determine how many scrap solder spatters are in the soldering system process.