Application of FMEA (Failure Mode & Effect Analysis) To Identify Failures In The Micro Switch Auto Soldering Process at PT X

Abstract

Quality control is an essential factor in maintaining process stability and ensuring product quality in manufacturing industries. In the micro switch auto soldering process at PT X, several recurring defects such as thermal damage, excess solder, insufficient solder, burnt wire, and non-wetted side were identified, resulting in reduced production efficiency and product quality. To systematically identify and prioritize these failures, the Failure Mode and Effects Analysis (FMEA) method was applied by evaluating Severity (S), Occurrence (O), and Detection (D) to obtain the Risk Priority Number (RPN). The analysis results showed that non-wetted side and insufficient solder had the highest RPN values, indicating that they were the most critical defects. Based on the analysis, several corrective actions were proposed to minimize the causes of failure and improve process performance. The implementation of these actions contributed to better process control and reduced the risk of defects in the auto soldering process.