Analysis Defect Alignment Out pada PCB saat proses Mounting

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dc.contributor.advisorSani,Abdullah
dc.contributor.authorGultom,Fransiskus Juanda
dc.date.accessioned2025-07-02T01:21:00Z
dc.date.issued2023-01-16
dc.description.abstractSurface Mount Technology atau sering disebut SMT merupakan teknologi terbaru yang digunakan untuk menempelkan komponen elektronik ke permukaan PCB. Komponen elektronik yang dapat dipasang oleh mesin SMT adalah komponen Surface Mount Device (SMD).
dc.identifier.citationIEEE
dc.identifier.kodeprodiKODEPRODI20406#TEKNIK ELEKTRONIKA MANUFAKTUR
dc.identifier.nidn0009018106
dc.identifier.nidn8903550022
dc.identifier.nidn0025118204
dc.identifier.nidn0020068902
dc.identifier.nim3221911007
dc.identifier.urihttps://repository.polibatam.ac.id/handle/PL029/4047
dc.language.isoother
dc.publisherPoliteknik Negeri Batam
dc.subjectTECHNOLOGY::Electrical engineering, electronics and photonics::Electronics
dc.subjectTECHNOLOGY::Electrical engineering, electronics and photonics
dc.titleAnalysis Defect Alignment Out pada PCB saat proses Mounting
dc.typeArticle

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