Analysis Defect Alignment Out pada PCB saat proses Mounting

Simple item page
dc.contributor.advisorSani,Abdullah
dc.contributor.authorGultom,Fransiskus Juanda
dc.date.accessioned2025-07-02T01:21:00Z
dc.date.issued2023-01-16
dc.description.abstractSurface Mount Technology atau sering disebut SMT merupakan teknologi terbaru yang digunakan untuk menempelkan komponen elektronik ke permukaan PCB. Komponen elektronik yang dapat dipasang oleh mesin SMT adalah komponen Surface Mount Device (SMD).
dc.identifier.citationIEEE
dc.identifier.kodeprodiKODEPRODI20406#TEKNIK ELEKTRONIKA MANUFAKTUR
dc.identifier.nidn0009018106
dc.identifier.nidn8903550022
dc.identifier.nidn0025118204
dc.identifier.nidn0020068902
dc.identifier.nim3221911007
dc.identifier.urihttps://repository.polibatam.ac.id/handle/PL029/4047
dc.language.isoother
dc.publisherPoliteknik Negeri Batam
dc.subjectTECHNOLOGY::Electrical engineering, electronics and photonics::Electronics
dc.subjectTECHNOLOGY::Electrical engineering, electronics and photonics
dc.titleAnalysis Defect Alignment Out pada PCB saat proses Mounting
dc.typeArticle

Files

Original bundle

Now showing 1 - 2 of 2
No Thumbnail Available
Name:
PA_3221911007_FRANSISKUS JUANDA GULTOM.pdf
Size:
0 B
Format:
Adobe Portable Document Format
Download
No Thumbnail Available
Name:
3221911007_Fransiskus Juanda Gultom.jpeg
Size:
238.33 KB
Format:
Joint Photographic Experts Group/JPEG File Interchange Format (JFIF)
Download

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download

Collections

D3 Teknik Elektronika Manufaktur