Clamper Buy Off Analysis and Storage Management at the Wire Bonding Process

Abstract

Wire bonding is the process of making interconnections between metallized bond pads with leads or other semiconductor devices with conducting wires. Inside the wire bonding machine there are various tools such as Clamper, which functions as a main frame holder during the bonding process. Before the clamper is used, it is necessary to purchase the clamper first, the purpose is to find out whether the clamper is according to standard or not and when the machine is running the technician can find out the problems associated with the clamper. The clamper will be tested and inspected both visually and testing, and from the results of the inspection a conclusion can be drawn about the clamper and the test data will be analyzed using the Box Plot method. Then, because there are many types of clampers with various packages in the Development Department that are not managed, for example where the clamper is stored, the current position of the clamper, its physical form and identity, it is necessary to make management to unite all data related to the clamper. This management method is in the form of database collection, then processed in excel software in the form of a system that is expected to facilitate users in the Development Department in finding information, storage and management of clamper inventory to be used.