Analysis of Automatic TDSON Bond Line Thickness (BLT) on the CyberSCAN CT-300 Machine with GR&R and T-Test

Abstract

Abstract--Die Attach SON is the process of moving and placing the die from the wafer to the leadframe that has been applied with solder paste, then placing the clip on top of the die that has been bonded to the leadframe that has been applied with solder paste. Bond Line Thickness (BLT) is one of the important aspects that must be considered in the die mounting process. And the BLT value must be measured quickly and accurately using an automatic machine, namely by using the CyberSCAN CT-300 machine. However, the CyberSCAN CT-300 machine is the latest measurement machine at PT Infineon Technologies Batam, and is still in the development stage to determine the BLT value. So some testing and analysis of the measurement results of the CyberSCAN CT-300 machine was carried out. So the hypothesis arises how to measure and prove the results of the BLT sample measurement test carried out using the CyberSCAN CT-300 machine in accordance with its specifications. So the optimization of CyberSCAN CT-300 is done with the Gage Repeatability & Reproducibility (GR&R) method which aims to find out whether the CyberSCAN CT-300 machine can make measurements consistently or not. And After analysis, a %GR&R result of 7,16% was obtained, which is in an acceptable position, which means that the CyberSCAN CT-300 measurement system is acceptable and can measure the TDSON Bond Line Thickness (BLT) consistently