Analysis of Low Power Defects in Polycrystalline Solar Panels Using Root Cause Analysis (RCA) and Failure Mode and Effect Analysis (FMEA)

Abstract

This Study focuses on reducing the percentage of defects and preventing defects frequently found in the production process in the solar panel industry. This study was conducted using the Root Cause Analysis (RCA) and Failure Mode and Effect Analysis (FMEA) methods. This research focuses only on solar panel polycrystalline 590W. The observational data used in this study were results of production data collection, visual inspection, soldering process analysis, and equipment maintenance. The results of the analysis indicate that the main of root cause is the lack of documentation solder tip cleaning procedures and no regular cleaning schedule, resulting in the accumulation of residue on the solder tip. This condition results in poor soldering results and disruption of electrical connectivity between the busbar and junction box. This study focuses on the most frequently found defect data, namely low-power defects. From the data that has been collected, this study also determines a solution to the problem that occurs, namely the implementation of work instructions. This study proves that after standardizing solder tip cleaning, it provides a significant reduction in low-power defects, with a percentage of defect rate reduction efficiency is 97,3%.