Optimization Parameter of Robotic Solder to Reduce Soldering Defects in PCBA Production

Abstract

This study aims to optimize process parameters in a robotic soldering system to reduce soldering defects in PCBA (Printed Circuit Board Assembly) production. Despite the use of robotic soldering to improve consistency and efficiency, defects such as insufficient solder and no solder are still observed in the production process. This research applies a structured approach using Cause–Effect Structure (CES) and Fault Tree Analysis (FTA) to identify dominant root causes of soldering defects. Based on the analysis, wire feed rate and dwell time were selected as critical process parameters. A two-factor factorial Design of Experiments (DOE) with three replications was conducted to analyze the effect of these parameters on soldering defects. The results of this study are expected to determine the optimal combination of wire feed rate and dwell time that minimizes soldering defects, thereby improving soldering quality and production efficiency in PCBA manufacturing.