Analysis of Solder Void Reduction Using Heller Vacuum Reflow Oven

Abstract

Solder voids are one of the output characteristics checked on the Die Attach Process. Nowadays, the requirements are very strict especially for Automotive Applications. From 10%-cumulative void, 5% single-void to 5%-cumulative void, 3% single-void which is a big challenge for semiconductor manufacturers. With this, vacuum reflow ovens were chosen to be used to meet these solder void requirements. This research will demonstrate the use of process mapping to streamline the focal process step.The author took data from standard and vacuum reflow ovens to see the decrease in solder voids after the reflow oven process. The author through this research, can reduce solder voids to 5%-total voids, 3%-single voids and can improve product reliability. The author conducted tests that allowed to see the difference between the two reflow oven methods and displayed through charts and box plot graphs. The results obtained are satisfactory and more than the results expected by the author so that they can meet industry standards and make better products as well.

Keyword: Die Attach Process, Heller Vacuum Reflow Oven , Solder Void