Analysis of Soldering Process Factors Affecting Jumper Detachment Failure in Automotive Product Life Test

Abstract

Automotive electronic products require a high level of reliability because they operate under extreme temperature and humidity conditions and play a critical role in vehicle safety. One of the key factors affecting product reliability is the quality of solder joints, particularly jumper wire connections that serve as electrical interconnections during the Automotive Product Life Test. This study aims to analyze the characteristics of jumper detachment failure and identify the soldering process factors contributing to its occurrence in order to determine effective corrective actions. Data were collected through continuity testing, visual inspection, and recording of jumper failure occurrences during Heat testing at 155°C and Moisture testing at 85°C at predetermined inspection intervals. The collected data were analyzed using a Pareto Diagram to identify the dominant failure mode, followed by Root Cause Analysis (RCA) using the Fishbone Diagram and the Five Whys method to determine the factors contributing to jumper detachment. Based on the analysis results, corrective actions were implemented to improve the soldering process and process control, and their effectiveness was evaluated by comparing the conditions before and after implementation. The results demonstrate that the proposed improvements successfully reduced jumper detachment occurrences and enhanced solder joint reliability during the Automotive Product Life Test. The findings provide practical recommendations for improving soldering process quality and enhancing the reliability of automotive electronic products.