IMPROVEMENT OF DROP COMPONENT AND PCB WARPING FOR PCBA PFU SMT PROCESS OPTIMIZATION

Abstract

This study addresses the optimization of the Printed Circuit Board Assembly (PCBA) process, specifically focusing on resolving issues related to drop components and PCB warping during the Surface Mount Technology (SMT) process at PT. SIIX Electronics Indonesia. The primary problem identified was the high rate of defects in the PCBA process for the PFU model, which significantly impacted production efficiency and quality. To tackle these issues, a comprehensive literature study was conducted, followed by data collection and observation. The proposed solution involved two main strategies: the application of ADE420D epoxy to minimize drop components and the installation of stiffeners to reduce PCB warping. The testing and optimization process followed a rigorous design methodology, iterating through test designs and repair testing to ensure effectiveness. The results after implementing these optimizations were promising. The occurrence of drop component defects decreased by 94%, andPCB warping defects were reduced by 84%. These improvements indicate a significant enhancement in the overall PCBA process quality, although further optimization is needed to achieve the target of zero defects.