Optimization of IC 32 QFP Pick Up Parameters

Abstract

In the pick and place machine with the SM421 model located at TFME (Teaching Factory Manufactur Electronic), until now there has not been an optimal size and parameters for 32 QFP IC components. So that when using the IC 32 QFP component, the machine user must first update or change the component size and determine the parameters. This will take a long time. In its own concept, the purpose of using a pick and place machine in the SMT process is to pick and place small components onto the PCB pad quickly and accurately (without offset). The purpose of this optimization is to shorten the process time when using 32 QFP IC components on a pick and place machine. In optimizing this machine, the DOE method is carried out by experimenting with several parameters and then comparing the results of each combination. The results of this study are based on a small offset and the offset value does not exceed the class 3 standard. So based on the experiments that have been carried out, the optimal parameters are in combination 2 with a pick up delay time of 50s and using soft touch (mount).