Analysis the Cause of Wire Breaks in The Frame Bonding Process

Abstract

The Frame Bonding process is also commonly known in the world of the Semiconductor industry as the Wire Bonding Process. This is the process of connecting a chip to a substrate via a wire bonded to a supporting structure, for example from a terminal pad to a substrate made of aluminum (Al). This process is an important process in the semiconductor backend to ensure the connection between the pad terminal and the substrate can be connected. Based on the background of the problems found, I conducted research aimed at reducing the occurrence of cable breaks which could result in the connection between the terminal pad and substrate on the BJ machine breaking down according to production quality standards. In this method we will look for engine stability on a BJ 920 type machine.