Analysis of the Defect's Causes Not Complete Soldering on Reflow Oven Machine using RCA Techniques

Abstract

The efficiency of the production process against not complete soldering defects encourages the application of Quality by control strategy for semiconductor components in the form of DCB modules as a scientific approach based on the application of quality risk in semiconductor component product development. This article aims to provide knowledge about the root cause analysis method that can be used in risk management for problems that occur in the manufacturing industry. The results of the article review of root cause analysis methods, such as Pareto Analysis, Fishbone Diagram, 5Whys, Failure Mode and Effect Analysis, can be used to find the root cause of a problem with differences in each method in terms of stages, analysis and risk assessment. The benefit of this article is that every company can make improvements to the crucial factors that trigger the not complete soldering defect and prevent and even solve this defect so that the company gets low costs and large profits.