Analysis the Causes of Defect Excess RTV (Room Temperature Vulcanizing) in PCB Holes Using RCA Method

Abstract

The application process of Room Temperature Vulcanizing (RTV) silicone in Printed Circuit Board Assembly (PCBA) often causes excess RTV defects. Excess RTV defects occur when silicone material flows excessively into PCB holes and causes pad contamination. To identify this problem, this study uses the Root Cause Analysis (RCA) method. This method can systematically identify the root causes based on data and is effective in analysing the factors that affect the quality of the production process. RCA is supported by the use of Fishbone Diagrams, Bar Charts, and Control Charts, which help map potential causes, determine the most dominant problems, and monitor process stability. Through field observations, analysis of the suitability of Work Instructions (WI), and evaluation of tool conditions and application methods, this study aims to find the main cause of excess RTV so that corrective actions can be directed appropriately and prevent recurring defects. The expected results are a reduction in defect rates and a continuous improvement in PCBA product quality.