Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process

Abstract

A Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.