Comparative Analysis of the Three Dispensing Patterns in the Die Attach Process

Abstract

The die attach process is a critical stage in integrated circuit (IC) manufacturing, as it attaches the chip to the substrate or leadframe using adhesive materials such as epoxy, solder, or DAF tape. This study investigates the effect of three dispensing pattern variations—Double Y, Z, and Cross—on epoxy distribution using a single die size under constant process parameters. The objective of this study is to analyze and compare the influence of these dispensing patterns on four main quality parameters: coverage, fillet width, fillet height, and bondline thickness. Data collection was conducted using a CT300 machine and a digital microscope to ensure accurate and consistent measurements. The collected data were analyzed using Microsoft Excel and Minitab software to evaluate the adhesive distribution characteristics of each pattern. The results of the One-Way ANOVA indicate a significant difference among the dispensing patterns (p-value < 0.05). Furthermore, the Tukey post-hoc test shows that the Double Y pattern provides the best performance compared to the other patterns. Therefore, the Double Y pattern is recommended for implementation in the production process to ensure consistent product quality in accordance with industry standards.