Optimization of Shielding Cover Mounter Process Parameters to Reduce Defects in SMT Line

Abstract

This study seeks to optimise process parameters in a Surface Mount Technology (SMT) Shielding Cover mounter to reduce defect occurrence. A thorough factorial Design of Experiments (DOE) with five parameters including vacuum pressure, blow vacuum pressure, head speed, mount waiting time and material waiting time was undertaken with 32 experimental combinations. Each combination was evaluated with 16 PCBA samples to determine pickup failure, missing components, and PCB damage. The results indicate that vacuum pressure and head speed are the most influential parameters. The best parameter combination was determined to be -42 kPa vacuum, 38 kPa blow vacuum, 60 mm/s head speed, 150 ms mount waiting time and 100 ms material waiting time. This setup resulted in a 44.44% improvement in total faults, from 9 to 5. The result of this investigation demonstrates that the DOE-based optimisation achieves a significant enhancement in the SMT process stability and product quality.