Analysis of Insufficient Glue Defects In The Die Attach Process

Abstract

The die attach process is one of the critical processes in semiconductor manufacturing, where conductive epoxy is used to bond the semiconductor die to the leadframe. An insufficient amount of epoxy coverage may result in an Insufficient Glue defect, which can affect the quality and reliability of the die attach interface. Therefore, controlling epoxy coverage is important to ensure that the bonding area between the die and leadframe meets the required acceptance criteria. This study aims to analyze the causes of Insufficient Glue defects in the die attach process and to implement corrective actions to reduce the occurrence of the defect. The study was conducted on the die attach process using the ASMPT AD8312+ machine. The analysis was performed using machine alarm history, process observation, microscope observation, and Post Epoxy Inspection (PEI) results. Root cause analysis was conducted to identify the factors contributing to insufficient epoxy coverage. The results of the analysis showed that the Insufficient Glue defect was related to the epoxy dispensing condition and the machine parameter setting. Corrective actions were implemented by optimizing the relevant dispensing parameters and validating the epoxy coverage condition through the PEI system. The validation results showed an improvement in epoxy coverage, where the optimized condition achieved the required acceptance criteria without causing Excess Glue defects. This study demonstrates that proper control and optimization of the die attach process parameters are important to maintain sufficient epoxy coverage and reduce the occurrence of Insufficient Glue defects. The implemented corrective action can contribute to improving process stability and maintaining the quality of the die attach process.