Analysis of PCB Defects in the Reflow Soldering Process Using the PFMEA Method

Abstract

Abstract— This research analyzes errors in the reflow soldering process on Surface Mount Technology (SMT) with PFMEA method that often result in defects on printed circuit boards (PCB), such as tombstoning and bridging which can reduce production quality. The defects are caused by several factors, namely unstable temperature profile parameters, uneven use of solder paste, suboptimal stencil design, use of too much solder paste. Preventive solutions were implemented, including solder oven reflow calibration, squeegee function with good pressure when printing solder paste, optimal opening design, stencil mold volume. Monitoring results showed that these corrective actions reduced the production reject rate from 6.46% to 2.52% indicating the effectiveness of the measures taken. Keyword: PCB Component Defects, Reflow Soldering Process, Process Failure Mode and Effects Analysis (PFMEA).