Calibration Process of Capillaries and Blade on Wire Bonding Machine
| dc.contributor.advisor | ||
| dc.contributor.author | Qurahman, Taufik | |
| dc.date.accessioned | 2025-01-03T07:35:08Z | |
| dc.date.issued | 2024-07-10 | |
| dc.description.abstract | Blade and capillary is one of the main components located in a wire bonding machine system with a process using the HK-116 type which can affect productivity in the bonding process. this study aims to analyze the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. the analytical method used in this study is a qualitative analysis method. this type of research uses a qualitative descriptive approach, namely describing and analyzing the problems found. | |
| dc.identifier.citation | Infineon | |
| dc.identifier.kodeprodi | KODEPRODI20406#TEKNIK ELEKTRONIKA MANUFAKTUR | |
| dc.identifier.nim | NIM3222101041 | |
| dc.identifier.uri | http://103.209.1.147:4000/handle/PL029/2954 | |
| dc.language.iso | en | |
| dc.subject | SOCIAL SCIENCES::Social sciences::Education | |
| dc.title | Calibration Process of Capillaries and Blade on Wire Bonding Machine | |
| dc.type | Book |
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