Analysis Defect Missing Material Foam Pad on XYZ Model

Abstract

The missing material foam pad defect is one of the issues identified in the back-end assembly process of model XYZ at PT PCI Elektronik International. This issue occurs when the foam pad is not installed in accordance with established work standards, potentially affecting product quality. This study aims to reduce the occurrence of such defects and analyze their root causes using the Root Cause Analysis (RCA) method and Fishbone diagram. The results indicate that human factors and work methods are the primary contributors. Based on these findings, several improvement proposals are formulated to minimize defects and enhance overall production quality.