Analysis of Glueing Damage on the Baseplate
dc.contributor.advisor | Sugandi, Budi | |
dc.contributor.author | Pohan, Dam Huri | |
dc.date.accessioned | 2025-01-03T08:40:07Z | |
dc.date.issued | 2024-06-06 | |
dc.description.abstract | Glueing is one of the main components located in the GFR machine system (glueing, frame mounting, riveting). which can affect productivity in the gluing process on the base plate. This study aims to analyze the frequent glueing damage in single dual modules and pim2 & steck2 modules, econo dual caused by parameter setting errors and WT usage errors, curved needles, contaminated needles, soldering along adhesive lines, adhesive contour shifts. The analytical method used in this study is qualitative analysis method. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. The results showed that every use of the correct parameters and the use of the right WT will have an impact on good results, as well as increase productivity on GFR machines. | |
dc.identifier.kodeprodi | KODEPRODI20406#TEKNIK ELEKTRONIKA MANUFAKTUR | |
dc.identifier.nidn | NIDN0021037307 | |
dc.identifier.nim | NIM3222101004 | |
dc.identifier.uri | http://103.209.1.147:4000/handle/PL029/3041 | |
dc.language.iso | en | |
dc.subject | TECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineering | |
dc.subject | TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics | |
dc.title | Analysis of Glueing Damage on the Baseplate | |
dc.type | Article |
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