Analysis Defect Non-Wetting U7 on PCBA Model DM3XX

Abstract

The DM3XX production process, non-Wetting rejects were found. The most difficult aspect of any solder defect on area array package is inability to observe defect easily. It's important to understand the characteristics of solder defects to identify appropriate actions to reduce defects in soldering process. Head-in-pillow defects are solder defects in area array packages characterized by a lack of coalescence between the solders. The purpose of this study was to determine causes of Non-Wetting U7 IC (CG201-10022-1R00) DM3XX and to prevent occurrence of Non-Wetting U7 IC DM3XX. To find out causal factors and prevent occurrence of U7 IC Non-Wetting, a fishbone diagram approach and mapping process are needed in this study. After analysis using fishbone diagram and why why analysis, defect non-Wetting caused by bent U7 leads, resulting in uneven soldering in reflow process. The bent position of U7 leads can't be corrected in other SMT processes. It can only be prevented using AOI. The AOI value required in non-wetting to process assembly is at level 70 for lower and 70 upper spec checking. Both factors have contributed to the decrease in reject produced by the process. Has an influence of 98.92% so it will be effective when implemented.