Analysis of the Effect of Saw Feed Speed in Die Edge Chipping in the Wafer Dicing Process

Abstract

Die chipping is one of the major defects in the wafer dicing process because it can reduce product quality and manufacturing yield. This study investigates the effect of feed speed variation on die chipping characteristics during the wafer dicing process using the One Factor at a Time (OFAT) method. Feed speed was varied at three levels (10 mm/s, 20 mm/s, and 30 mm/s), while all other process parameters were kept constant. Three response variables were evaluated: Backside Chipping, Sidewall Chipping, and Cutting Angle. The collected data were analyzed using one-way Analysis of Variance (ANOVA), followed by Tukey's post-hoc test when significant differences were identified. The results showed that feed speed had a significant effect on Backside Chipping (P-value = 0.023), whereas no significant effect was observed on Sidewall Chipping and Cutting Angle. Among the evaluated feed speed levels, 20 mm/s produced the lowest average Backside Chipping value of 31.41 µm and was identified as the optimal feed speed for the evaluated device specification. These findings indicate that proper feed speed selection can reduce Backside Chipping while maintaining stable Sidewall Chipping and Cutting Angle, thereby improving the overall quality of the wafer dicing process