Developmend and implementation of an automated aucoated area control parameter to improve chemical efisiensi in the PCB conformal coating proses

Abstract

The PCB (Printed Circuit Board) conformal coating process plays a crucial role in protecting electronic components from moisture, corrosion, and environmental contamination. However, conventional coating processes often result in excessive chemical usage due to uncontrolled spraying on areas that do not require coating, such as connectors and test pads, leading to material waste and increased production costs. This research aims to develop and implement an automated uncoated area control parameter to improve the efficiency of chemical usage in the PCB coating process. This study employs an experimental research method by comparing a conventional coating process with a coating process integrated with an uncoated area parameter. A total of 2,000 PCB units were used as samples, consisting of 1,000 units coated using the conventional method and 1,000 units coated using the developed parameter. Data were collected through direct observation, coating thickness measurements, machine data logs, and defect analysis. The results show that the implementation of the uncoated area parameter successfully reduced chemical consumption by approximately 15–20% per production batch. In addition, coating-related defects such as uncoating, uneven coating, and excess coating were reduced from an initial rejection rate of 5–10% to 0%. These results indicate that the developed parameter effectively improves chemical efficiency while maintaining coating quality in accordance with IPC-CC-830 standards. This research demonstrates that the use of an automated uncoated area control parameter can significantly enhance production efficiency, reduce chemical waste, and support cost-effective and environmentally friendly practices in the electronics manufacturing industry.