Quality Control Study Using Six Sigma DMAIC To Minimize Defects In The Soldering Process

Abstract

Quality control is an important aspect in the manufacturing industry to ensure that the products produced meet quality standards and minimize the occurrence of defect during the production process. The problem faced in the soldering system process at Infineon Technologies AG Cegléd, Hungary is the high number of defective products that impact the effectiveness of the production process and the achievement of company targets. This study aims to identify the most dominant types of defect, analyze the stability of the production process, and determine the main causes of defects as a basis for preparing improvement recommendations. The method used is Six Sigma with a DMAIC approach limited to the Define, Measure, and Analyze stages. The Define stage uses Pareto Diagrams and Quick Wins to determine defect priorities and improvement opportunities, the Measure stage uses a P-Chart to evaluate process stability, while the Analyze stage uses Failure Mode and Effect Analysis (FMEA) to determine the priority of failure causes based on Severity, Occurrence, Detection, and Risk Priority Number (RPN) values. The results of the study indicate that Not Complete Soldering defects are the most dominant type of defect with 889 occurrences or 41.26% of the total defects during the period August-November 2023. P-Chart analysis shows a pattern of eight consecutive points experiencing a decrease, which indicates that the production process is not yet in a statistically controlled condition so that corrective actions are still needed. The results of the FMEA analysis show the highest RPN value of 240, which is caused by incorrect placement of DCB on the JIG due to excessive pressure during the production process.