Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)

Abstract

Non-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.