MISSPUNCH DEFECT ANALYSIS AND OPTIMIZATION IN AUTOVISION MACHINE

Abstract

In the era of technological globalization and the development of the manufacturing industry which is growing rapidly. Currently, companies in the manufacturing sector are continuously trying to improve the quality and quantity of products that will be produced and can last a long time to support the main needs for technology globally. Integrated Circuit (IC) is now needed for all kinds of electronic devices. PT Infineon Technologies Batam is one of the companies engaged in the manufacture of semiconductor electronic components and especially IC. The process to manufacture IC in PT Infineon has several steps which are Pre-Assembly - Die attach - Wire Bond - A2 Platting - Autovision - Molding - Platting - Marking - Trim & Form - Testing – Packing. From several steps mentioned above, Autovision is the process to mark defect in leadframe with the help of machine vision. However, sometime it causes another error because it incorrectly marks the leadframe. This project tries to reduce this issue by finding the potential problem using Fishbone diagram and SWOT analysis. Based from the analysis, the problem is caused by indexer parameter. After performing treatment to this root cause problem, the Autovision product defect have decreased from 2.7% to 0.7%.