Analysis Broken Wire Module Econo Pack+B in Wire Bonding Process

Abstract

Since the establishment of the new Econo line back end site, Infineon Technologies Cegled Kft has experienced quite rapid improvements in every production line including the wire bonding area. This increase in production in the wire bonding area resulted in a high number of rejected broken wires which resulted in failure of the Econo Pack+B product which resulted in expensive production costs resulting in losses for the company and production output not being achieved. So that the root cause of the broken wire defect can be known for certain and controlled which will have an impact on improving the quality process and achieving the production target yield of 95.4% to increase the key performance indicator of the production area and achieving a stable process in the wire bonding process based on the value cpk shear test.