Analysis Process Requirement After Safe Launch at Die Attach Process Focused on Package LDSO-14-2
Repository Politeknik Negeri Batam
Date
2024-07-23
Authors
Pratama,Efri
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Abstract
Safe Launch is used in the semiconductor IC
industry to describe and validation process before the final
product is launched to production. In author department,the
Process Integrated Department (PI) have responsbility to ensure
the product meets all specified requirements. Die attach also
known in semiconductor industry as die bonding, it is the process
attaching die onto the leadframe. At Infineon, when a new product
is about to be launched, PSFLA monitoring will be conducted.
Products in PSFLA will be run with a production environment and
will be assessed for each process, from pre-assembly to MSP test.
In this project, the author will focus on the SFLA process of
package LDSO-14-2 at Die Attach Process. Author must ensure
that this package must meet the specifications and can be used and
applied at PT Infineon Batam. For this project, the method of
analysis used is box plot and pareto chart, after the safe launch of
the die attach process has been carried out, the author can collect
data and analyze related to the title of this project.
Description
Keywords
TECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineering
Citation
JAEE