Analysis Process Requirement After Safe Launch at Die Attach Process Focused on Package LDSO-14-2

Abstract

Safe Launch is used in the semiconductor IC industry to describe and validation process before the final product is launched to production. In author department,the Process Integrated Department (PI) have responsbility to ensure the product meets all specified requirements. Die attach also known in semiconductor industry as die bonding, it is the process attaching die onto the leadframe. At Infineon, when a new product is about to be launched, PSFLA monitoring will be conducted. Products in PSFLA will be run with a production environment and will be assessed for each process, from pre-assembly to MSP test. In this project, the author will focus on the SFLA process of package LDSO-14-2 at Die Attach Process. Author must ensure that this package must meet the specifications and can be used and applied at PT Infineon Batam. For this project, the method of analysis used is box plot and pareto chart, after the safe launch of the die attach process has been carried out, the author can collect data and analyze related to the title of this project.