Analyzing Wire Breakage Failure During Bonding Process

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Date

2024-06-14

Authors

Sinaga,Marupa Daniel

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Abstract

Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,Capillary

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Keywords

TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics, TECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineering

Citation

JAEE

URI

http://103.209.1.147:4000/handle/PL029/3060

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D3 Teknik Elektronika Manufaktur

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