Analyzing Wire Breakage Failure During Bonding Process
Repository Politeknik Negeri Batam
Date
2024-06-14
Authors
Sinaga,Marupa Daniel
Journal Title
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Abstract
Frame bonding is the name of an area at
infineon with a working method of connecting cables to
frames or ic. the author took this title because of the
author's anxiety about the failure of this bonding process.
And the author took a qualitative method by asking all
technicians regarding the failures that occurred in this
process.
Keywords: Bonding,Wire,Failure,Capillary
Description
Keywords
TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics, TECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineering
Citation
JAEE