Analyzing Wire Breakage Failure During Bonding Process
| dc.contributor.advisor | Wivanius,Nadrah | |
| dc.contributor.author | Sinaga,Marupa Daniel | |
| dc.date.accessioned | 2025-01-03T09:03:36Z | |
| dc.date.issued | 2024-06-14 | |
| dc.description.abstract | Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,Capillary | |
| dc.identifier.citation | JAEE | |
| dc.identifier.kodeprodi | KODEPRODI005029#Teknik_Elektronika_manufaktur | |
| dc.identifier.nim | 3222101023 | |
| dc.identifier.uri | http://103.209.1.147:4000/handle/PL029/3060 | |
| dc.language.iso | en | |
| dc.subject | TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics | |
| dc.subject | TECHNOLOGY::Industrial engineering and economy::Manufacturing engineering and work sciences::Manufacturing engineering | |
| dc.title | Analyzing Wire Breakage Failure During Bonding Process | |
| dc.type | Article |
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