Jurusan Teknik Elektro

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  • Repository Politeknik Negeri Batam
    Item
    Analysis of Solder Void Reduction Using Heller Vacuum Reflow Oven
    (2024-07-31) Evan S , Ferdi;
    Solder voids are one of the output characteristics checked on the Die Attach Process. Nowadays, the requirements are very strict especially for Automotive Applications. From 10%-cumulative void, 5% single-void to 5%-cumulative void, 3% single-void which is a big challenge for semiconductor manufacturers. With this, vacuum reflow ovens were chosen to be used to meet these solder void requirements. This research will demonstrate the use of process mapping to streamline the focal process step.The author took data from standard and vacuum reflow ovens to see the decrease in solder voids after the reflow oven process. The author through this research, can reduce solder voids to 5%-total voids, 3%-single voids and can improve product reliability. The author conducted tests that allowed to see the difference between the two reflow oven methods and displayed through charts and box plot graphs. The results obtained are satisfactory and more than the results expected by the author so that they can meet industry standards and make better products as well. Keyword: Die Attach Process, Heller Vacuum Reflow Oven , Solder Void
  • Repository Politeknik Negeri Batam
    Item
    Lift Off Defect Analysis In Wirebonding Process
    (2024-06-25) Nauval, Muhammad Ivnu
    Lift off defect was occurred a lot in wirebonding area during September 2023, with fishbone and FMEA analysis, writer concluded that the main reason of it are ultrasonic force and clamp power failure. Ultrasonic force shear test is done to see how the forces affect the shape of the bonded wire and also the power of the wire itself. With 6 different parameters applied, writer gains different results for each parameter which are: 40KHz, 45KHz, 50KHz, 55KHz, 60KHz, 65KHz. The standard of wire strength is 1900g – 2900g or even more as long as there is no deformed bondfoot occur. 40KHz - 45KHz Ultrasonic force causing lift off defect the most, with only 1870g - 2010g wire strength, 50KHz – 60KHz is a stable parameter for bonding with wire power results between 1980g – 2890g with no liftoff, for 65KHz ultrasonic power the highest result of wire strength 3880g causing the wire to get deformed. Therefore, the range between 50KHz – 60KHz ultrasonic force is recommended. Meanwhile clamp power is divided into two, bolts clamp and vacuum clamp. Bolts clamp monthly failure is 3 while vacuum clamp is 7, the vacuum clamp receiving much more failure is caused by unstable vacuum pressure that happen sometimes while bolts clamp is less failed due to the stable hold by the bolts. After the rootcauses are found, the corrective action is made as a preventive way to avoid further failure, such as machine condition checking, one module checking, and further machine settings for technicians.