Risk Mitigation Of Damage To Electronic Integrated Circuit (IC) Products During Shipping Using The House Of Risk Method (HOR)

dc.contributor.advisorHarlan, Fandy Bestario
dc.contributor.authorSimbolon, Lidia
dc.date.accessioned2024-12-30T02:14:49Z
dc.date.issued2024-08-05
dc.description.abstractPT XYZ is a semiconductor company that produces many automotive products. Various products that have passed the assembly and testing process will then be sent to distribution centers in Asia and Europe. In company activities there are risks that are important to manage in order to smooth the flow of the company. In the process of shipping products, there is a risk of defects that trigger the return of goods to the company. Based on the company's IMC (Internal Management Complaint) data, the most common item damage is damaged product boxes (pallet boxes) that require corrective action. To minimize this risk, risk management is needed using the House Of Risk (HOR) method which aims to analyze and mitigate the risk of damage to goods in the process of shipping goods at PT XYZ. The HOR method identifies 21 risk events and 23 risk agents that have the potential to cause damage to goods. Based on the calculation of Aggregate Risk Potential (ARP), 5 risk agents are prioritized for handling. There are 12 handling strategies proposed to be able to reduce the possibility of risk agents in the company's goods delivery.
dc.identifier.citationAPA
dc.identifier.kodeprodiKODEPRODI005029#Logistik_Perdagangan_Internasional
dc.identifier.nimNIM4132001009
dc.identifier.urihttp://103.209.1.147:4000/handle/PL029/2709
dc.language.isoen
dc.publisherICAESS
dc.titleRisk Mitigation Of Damage To Electronic Integrated Circuit (IC) Products During Shipping Using The House Of Risk Method (HOR)
dc.typeArticle

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