D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

Browse

Now showing 1 - 2 of 2

ANALYSIS OF BROKEN PIN DEFECT ON MODULE DUAL MC CU IN ENDTEST PROCESS
(2024-08-08) Saleh, Ihzanuddin; Darmoyono, Aditya Gautama
Abstract— PIN in semiconductors is an acronym for "Positive-Intrinsic-Negative". This refers to the three-layer structure of some semiconductor components such as PIN diodes, which consists of a positive layer (P), an intrinsic or uncharged layer (I), and a negative layer (N). Pins have a variety of functions, in this case the pin is a component in semiconductors that functions as a connector from one component to another. Broken pins are failures that often occur in the Dual MC Cu module in the EndTest process, almost every load there must be broken pin damage, because this module uses sensitive needle pins compared to pins in other modules. There are several factors that affect broken pins, namely; a few wrong pin testing positions, adapters that are too strong in pressure, and from the previous process. This study was conducted to analyze the factors and prevent damage done to the EndTest process caused by broken pins in order to minimize the damage that occurs. This research uses the Fishbone Method and Pareto Chart. This research can analyze the failure, can find the aspects involved in the main failure, and find the causes of product defects in the EndTest production process.
Application of Six Sigma Techniques with a Focus On Statistical Process Control in Wiring Harness Production
(2024-08-15) Simanjuntak, Martua Yeremia; Darmoyono, Aditya Gautama
The wiring harness plays a vital role in a wide range of electronic devices, with a particular emphasis on its importance in the automotive sector. The objective of this study is to apply the Six Sigma method to enhance wire manufacturing quality in industrial settings. The process begins review the key steps of the Six Sigma process, which include Define, Measure, Evaluate, Improve, and Control (DMAIC).. Next, gather information on different phases of wiring harness production to evaluate the current quality of the product. The measurements results are utilized for analyzing the underlying reasons for issues and pinpointing areas requiring enhancement. This will result in tangible benefits by boosting customer satisfaction and enhancing the overall production process. . The research results show that the application of the Six Sigma process has succeeded in improving the quality of wiring harness production at this company. This will bring real benefits by increasing customer satisfaction and improving the overall production process.