D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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"Analysis of Terminal Failures in The Econo Dual Module at End Test Process
(0001-07-24) Evan,Antoni; Octowinandi,Vivin
— Econo Dual module is one of the manufactured products that has a good summary of features as high power desity,integrated temperature sensor available and RoHScompliant module,econo Dual also has advantages as compact module concept,optimized customer’s development cycle time and cost,configuration flexibility and econo dual can be applied to motor control and drives,industrial heating and welding,mine work and room air conditioners. But with all its advantages the econo dual module must also go through a final checking process, So that the module made can be used properly and perfectly for customers. Terminals are an important part of the module that serves to connect the electrical circuit system to the electrical circuit where the connection is not complex. And final checking using two methods, namely visual and mechanical checking.For this paper focuses more on checking terminals and errors and defects in the terminal part of the econo dual module.The author makes a final project entitled “ANALYSIS OF TERMINAL FAILURE IN THE ECONO DUAL MODULE AT END TEST PROCESS”, with the purpose of being able to analyze products that are categorized as failures and defects. Keywords: Failure Terminals Econo Dual module, End test process, Checking
Reduces the high reject chip die in the FOL area
(Gramedia Pustaka Utama, 2020-11-18) Ambarawati Wardhani Ninta, Angela; Arifin, Muhammad
Penggambaran tokoh dalam cerita menunjukkan bagaimana makanan digunakan sebagai simbol masalah dan konflik dalam hubungan antar karakter. Dengan demikian, tujuan dari penelitian ini adalah untuk menemukan serta menganalisis makanan yang dijadikan sebagai simbol masalah dan pengembangan karakter tokoh dalam cerpen “Sambal di Ranjang” karya Tenni Purwanti dan “Sambal Keluarga” karya Puthut EA.Penelitian ini menggunakan teori Semiotika Roland Barthes yang mengkaji tanda dibalik makanan yang memiliki arti penting dalam pembentukan karya sastra. Karena pada dasarnya, sastra bertema kuliner tidak hanya sekadar menggambarkan kreativitas dalam menyajikan hidangan, tetapi juga memiliki arti mendalam tentang sebuah makanan yang dihidangkan dengan beberapa aspek pendukung seperti sosial, budaya, filosofis yang digambarkan melalui tokoh dan peristiwa sehari-hari. Dalam kajian semiotika, makanan tidak hanya digunakan sebagai objek, melainkan juga sebagai media untuk membangun identitas individu dan budaya.Berdasarkan hasil analisis yang telah dilakukan, dapat disimpulkan bahwa sambal menjadi simbol paling kompleks yang digunakan untuk menggambarkan karakter dan masalah yang dihadapi oleh tokoh. Simbol masalah dan pengembangan karakter dari sambal menggambarkan emosional, keintiman, kepemilikan eksklusivitas, tradisi, hingga identitas suatu budaya yang tercermin dari kedua cerpen yang dijadikan sebagai objek penelitian. Selain itu, sambal juga menggambarkan ketegangan yang tengah dirasakan ketika konflik antara tokoh sedang bermunculan. Jadi, sambal digunakan sebagai mediator untuk menggambarkan hubungan antar tokoh.
Analisa Kegagalan Kartu RFID yang Tidak Terbaca oleh NFC Reader
(2022-07-08) SIHOMBING KENNEDI, RIO; Asaad Sakinah Nur
RFID adalah teknologi pengenal otomatis non-kontak yang menggunakan sinyal radio untuk mengidentifikasi, melacak, menyortir, dan mendeteksi berbagai objek termasuk orang, mobil, transportasi, tanpa perlu kontak langsung. Perangkat kartu RFID yang terdiri dari chip dengan connecting berupa lilitan antenna sehingga dapat dideteksi pada jarak tertentu. Dalam proses pembuatan manufaktur RFID dapat dilakukan beberapa proses yaitu proses Die Bonding, Epoxy Cure, Wire Bonding, Globtop, Globtop Cure, COB Singulation, Antenna Winding, Soldering, PVC Laminating. Teaching Factory Manufacturing of Electronics (TFME) merupakan perusahaan yang memproduksi kartu RFID dengan baik. Namun, sering terjadi kegagalan pada Kartu RFID yang tidak terbaca dengan menggunakan NFC Reader maka dari itu perlu dilakukan analisa menggunakan metode Nondestructive dan Destructive yang bertujuan mampu menyelesaikan masalah yang terjadi pada projek manufaktur RFID. Metode Nondestructive merupakan pengujian yang dilakukan pada material yang tidak menyebabkan kerusakan pada sampel tapi menggunakan alat seperti X-Ray sedangkan Metode Destructive merupakan pengujian atau pengetesan yang dilakukaan pemotongan Kartu RFID agar defect bisa terlihat menggunakan Mikroskop Keyence VHX-6000. Oleh karena itu, harus ada perbaikan yang nantinya akan memperbaiki yield dari produksi. Penulis menggunakan beberapa metode untuk mengurangi defect tersebut seperti fishbone diagram dan 5 why agar mempermudah penulis untuk mencari masalah yang terjadi pada kartu RFID yang tidak terbaca.
Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)
(Politeknik Negeri Batam, 2023-07-11) Permadhi, Dede Gading; Prebianto, Nanta Fakih; ; Wijanarko, Heru
Non-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.
Defect Analysis in Riveting Process
(2024) Marpaung, Willi Ferry Chaves; Arifin, Muhammad
Riveting is one of a process in making modules in Infineon Technologies – Hungary, Cegled. Rivet is the act of spreading out and clinching the end by pressing. Riveting has advantages such as a compact module concept, optimized customer development cycle time and cost, and configuration flexibility. The process of attaching the frame to the baseplate consists of DCB. However, everything that has advantages also has its disadvantages; also, in riveting, there are some disadvantages. So, the author does a final project titled “ Defect Analysis In Riveting Process ”.To analyze products, they can be classified as scrap or not. In this research, I used the fishbone diagram, diagram chart, and the data collection methods the authors used in this project to determine most often defects happen in the riveting process. The module that will analyzed is the dual module.
Analysis of the Needle Pin on the Adapter Dynamikus in KWK 1
(2024-02-25) Farhan,Reihan Agustino; Maulidiah,Hana Mutialif
Dynamikus is to check whether the module survives at the specified temperature and test the durability of the module, this research aims to analyze the failure of the needle pin then explain the impact of failure on the module, the causes of module problems, failures in the adapter and module, in this research the author is focused on one of the machines used is the KWK 1 machine, the KWK machine is a machine used to check or test the durability of the module, whether the quality of the module has been tested and the discussion in this analysis is focused on the DYNAMICUS adapter. This discussion concerns failures in the needle module and needle adapter, to understand how to reduce failures in the module and what prevents failure, the causes why. The analytical method used in this research is qualitative analysis, this type of research uses a qualitative descriptive approach that describes and analyzes the problems found. Keywords: Adapter,Dynamikus,Needle Pin
Analysis of the effectiveness of implementing internships in Hungary for improvement students
(2024-03-17) Radha, Savira; Jefiza, Adlian;
Analysis of the effectiveness of implementing internships in Hungary for improvement students
(2024-03-17) Radha Sellini, Savira; Jefiza, Adlian;
This study aims to analyze the effectiveness of internships abroad in developing skills, increasing cross-cultural understanding, and its impact on the professional careers of interns. This research involves monitoring and interviewing interns who took part in internship programs abroad during a certain period. The collected data was analyzed to evaluate the benefits of the international internship experience
Defect Inspection Of Burning Chips On Machine 13 Soldering System
(2024-04-20) Nazirah, Erni; Rika, Widya
Infineon Techonologies is an industrial company that produces Semiconductors such as Modules and Integrated Circuit (IC). At Infineon Technologies Cegled there are several processes, one of which is the System Soldering section. System Soldering is a Direct Copper Bonded (DCB) circuit process with solder paste on the Baseplate which will be reflowed. After reflow, it will become a module. When the soldering process is carried out, there is often a burning chip defect on the module, especially on the soldering system machine 13 which is caused by human error. This results in a decrease in the quality of production at the company. By looking at the above problems, the author made the project “Defect Inspection Of Burning Chips On Machine 13 Soldering System” which has the aim of preventing by providing process steps that can be understood using flowcharts can help prevent the occurrence of defect burning chips in the soldering process. Installing a flowchart on the machine with a language that can be understood by the operator and important points highlighted for easy understanding. With this final project, hopefully it can help the company in reducing the burning chip defect that occurs on the soldering system machine.
Failure Analysis of IC (Econo) Modules in Dynamic,Static, and ISO Process
(2024-05-02) Alfath,Ridho Muhammad; Arifin,Muhammad
Dynamic, Static, and ISO are adapters that are useful for testing modules on the machine. In this system, Dynamic, Static, and ISO have their respective roles in the testing machine with the process of using a KWK 4-type machine. This research aims to analyze the frequent module rejects that occur in dynamic, static, and ISO. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. Keyword: Adapter, ISO, Dynamic, Static
Econo Product Quality Analysis
(2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, Muhammad
The quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.
Failure Analysis of Electric Car Modules: Case Investigation on Econo Pack+B Products in Measurement Testing
(2024-06-03) Dinata Farhan Muhammad; Sani Abdullah
As demand continues to increase, Infineon Technology AG is facing an increase in production orders, which is a positive thing but also brings serious challenges in the process. This study aims to identify problems that arise in production by conducting an in-depth analysis of a crucial component in electric vehicles, The method used to solve the problem by making improvements to product quality testing, by making measurement tools. The results of observations of production defects for 3 months reached 4.72%, so the authors investigated the problem and made improvements to production using measurement tools. So that the results of defect observations using the method have changed Significant, Showing a figure of 0.56% in observations again for 3 months.
Analysis of Glueing Damage on the Baseplate
(2024-06-06) Pohan, Dam Huri; Sugandi, Budi
Glueing is one of the main components located in the GFR machine system (glueing, frame mounting, riveting). which can affect productivity in the gluing process on the base plate. This study aims to analyze the frequent glueing damage in single dual modules and pim2 & steck2 modules, econo dual caused by parameter setting errors and WT usage errors, curved needles, contaminated needles, soldering along adhesive lines, adhesive contour shifts. The analytical method used in this study is qualitative analysis method. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. The results showed that every use of the correct parameters and the use of the right WT will have an impact on good results, as well as increase productivity on GFR machines.
PERFORMANCE RATE DATA ANALYSIS OF OEE BY DATA RECORD SYSTEM MODIFICATION IN FINAL INSPECTION MACHINE
(2024-06-14) Firdaus, Muhammad; Prebianto, Nanta Fakih
The role of machinery is crucial in production to keep it optimized. The capacitor manufacturing process consists of assembly and final inspection. Analysis of the final inspection improvement shows that the decline in machine performance is caused by the repetition of inspection which causes lost time and affects the daily production time. The cause of detection errors is unpredictable and still unknown. This research measures the performance of machines in the manufacturing industry with the Overall Equipment Effectiveness (OEE) method and uses 7QC tools such as fishbone and flow charts. After the project was completed, it was found that the decline in the performance of the final inspection machine was due to a lack of focus in the analysis. The limited data after the final lot made it difficult to determine cameras with high inspection errors because inspection repetition data was not recorded. In this study, data from 10 manual inspection lots on each machine were taken, the average impact of re inspection was 14.1%, and the average performance after re-inspection was 81.6%. Camera 3 has the highest number of defects at 34% and camera 4 at 29%. The higher the number of camera defects, the greater the performance degradation in the inspection process.
Analysis Defect of the Econo PIM 3 Module in the Endtest Process (KWK 4)
(2024-06-14) Siregar, Willi Prayogi; Wikanta, Prasaja
The Econo PIM 3 Module is one of the module Processed through KWK 4 Machine in the Endtest Process Area. This module has a defect called Bent Pin and Burn Pin, so this research was prepared to find out the causes of the problems that occur and make improvements to prevent the occurence of these defects.
Analyzing Wire Breakage Failure During Bonding Process
(2024-06-14) Sinaga,Marupa Daniel; Wivanius,Nadrah
Frame bonding is the name of an area at infineon with a working method of connecting cables to frames or ic. the author took this title because of the author's anxiety about the failure of this bonding process. And the author took a qualitative method by asking all technicians regarding the failures that occurred in this process. Keywords: Bonding,Wire,Failure,Capillary
Scrap Analysis on Econo Pim 3 Module
(2024-06-24) Sitompul, Stephen; Nakul, Fitriyanti
Econo pim 3 module is one of the manufactured products that has a good summary of features as highs power density, integrated temperature sensor available and RoHS- compliant module. Econo pim 3 module also has advantages as compact module concept, optimized customers development cycle time and cost, configuration flexibility and econo pim 3 module can be applied to motor control and drives, industrial heating and welding and room air conditioners. But with all that advantages econo pim 3 module must go through a long process, during the manufacturing process the module is found scrap or not suitable to use, from many manufacturing process system soldering process is bottle neck of scrap found. The purpose of this research is to find the root cause of econo pim 3 module defects during system soldering process and to analysis defects that occur. This research uses the fishbone diagram method, which fishbone diagram is certainly carried help full in knowing the cause of the defects occurs. Fishbone diagram, also called as ‘cause-and-effect’ diagram, is a tool used to identify the root cause of problems which represents the effect and the factors or causes influencing it. [1] Keywords: Defects, Pim 3 Module, System Soldering Process, Fishbone diagram
Analysis of the Defect's Causes Not Complete Soldering on Reflow Oven Machine using RCA Techniques
(2024-06-24) AMELIA; Nakul,Fitriyanti
The efficiency of the production process against not complete soldering defects encourages the application of Quality by control strategy for semiconductor components in the form of DCB modules as a scientific approach based on the application of quality risk in semiconductor component product development. This article aims to provide knowledge about the root cause analysis method that can be used in risk management for problems that occur in the manufacturing industry. The results of the article review of root cause analysis methods, such as Pareto Analysis, Fishbone Diagram, 5Whys, Failure Mode and Effect Analysis, can be used to find the root cause of a problem with differences in each method in terms of stages, analysis and risk assessment. The benefit of this article is that every company can make improvements to the crucial factors that trigger the not complete soldering defect and prevent and even solve this defect so that the company gets low costs and large profits.
Lift Off Defect Analysis In Wirebonding Process
(2024-06-25) Nauval, Muhammad Ivnu
Lift off defect was occurred a lot in wirebonding area during September 2023, with fishbone and FMEA analysis, writer concluded that the main reason of it are ultrasonic force and clamp power failure. Ultrasonic force shear test is done to see how the forces affect the shape of the bonded wire and also the power of the wire itself. With 6 different parameters applied, writer gains different results for each parameter which are: 40KHz, 45KHz, 50KHz, 55KHz, 60KHz, 65KHz. The standard of wire strength is 1900g – 2900g or even more as long as there is no deformed bondfoot occur. 40KHz - 45KHz Ultrasonic force causing lift off defect the most, with only 1870g - 2010g wire strength, 50KHz – 60KHz is a stable parameter for bonding with wire power results between 1980g – 2890g with no liftoff, for 65KHz ultrasonic power the highest result of wire strength 3880g causing the wire to get deformed. Therefore, the range between 50KHz – 60KHz ultrasonic force is recommended. Meanwhile clamp power is divided into two, bolts clamp and vacuum clamp. Bolts clamp monthly failure is 3 while vacuum clamp is 7, the vacuum clamp receiving much more failure is caused by unstable vacuum pressure that happen sometimes while bolts clamp is less failed due to the stable hold by the bolts. After the rootcauses are found, the corrective action is made as a preventive way to avoid further failure, such as machine condition checking, one module checking, and further machine settings for technicians.
Analysis Of Needle Pin Adapter Dynamics In IGBT Module Endtest Process
(2024-06-29) Mufriki,Achmad; Octowinandi,Vivin
Needle Pin is a needle located on the dynamic adapter and functions to provide voltage to the IGBT module pins during the Endtest process. Many testing processes are not completed on time because some processes do not run according to schedule, especially in the Endtest process due to delays which result in long downtime, one of which is due to problems with testing dynamics. Damage to the dynamic adapter is mainly burnt and jammed needle pins. The author uses the fishbone method/Ishikawa diagram to find out the factors and root causes that cause burnt needle pins. The main root cause in this research is contaminated pins module. This research found that the value of P1 The average machine downtime before repair was 68.83 minutes, min 30 minutes and maximum 115 minutes and the percentage was 71.69%. And the value of P2 The average machine downtime after repairs was 55.08 minutes and the min was 20 minutes and the maximum was 85 minutes and the percentage was 57.37%. Based on the matrix, the comparison range for P1 and P2 is 14.32%.