D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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    Analyzing Pick Up Errors in The Pick and Place Process on The Yamaha Machine
    (Politeknik Negeri Batam, 2025-01-23) Ardiansyah, Jeffry; Maulidiah,Hana Mutialif
    This study analyzes pick-up errors in the pick-and-place process on Yamaha machines used in the manufacturing industry. These errors can impact productivity and product quality, with three main contributing factors identified: dirty or damaged nozzles, issues with the feeder system, and disturbances in the vision system. Preventive solutions were implemented, including maintenance and replacement of nozzles, optimization of feeder parameters, and regular calibration and cleaning of camera lenses. Monitoring results showed that these corrective actions reduced the error rate from 0.105% to 0.089%, demonstrating the effectiveness of the measures taken.
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    Improvement of Conveyor Gravity in Cleanroom Area
    (2025-01-23) Ramadhan, Iqdal; Wivanius, Nadrah
    Abstract— The conveyor system is a widespread hardware that controls products that will move materials from one position to another. The previous pattern on the conveyor unit used a belt to move the container by connecting the belt to the motor to move a certain base. The condition in the previous pattern was that the timing belt was irregular and the base became slippery which caused the belt to break, so that the production process stopped. The purpose of this paper is to change the conveyor system that previously used a belt to drive the container, now the author changes the way the conveyor works by moving the container without using a belt, using the gravity method, namely the conveyor path is made sloping with a height of 70-75 cm and a length of 5 meters (adjusting the length of the previous conveyor). so the container will slide on the path that is made sloping and the container reaches the stopping point the sensor will detect the container when the sensor detects that there is a container, the cylinder will work to carry the container up. Keyword: Conveyor, Pneumatic, PLC
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    Monitoring Temperature For Natural Convection Oven at PT Daihan Labtech
    (Politeknik Negeri Batam, 2025-01-23) Pardosi, Ockmond Beruntung Irico; Arifin,Muhammad
    PT Daihan Labtech is a foreign company from Korea based in Indonesia located at Batamindo Industrial Park, Jalan Randu No Lot 111, Muka Kuning, Batam. This company has some divisions: General Laboratory Equipment, BioMedical, Env. Bio Chamber/Room Division, Industrial Drying Test Chamber, Industrial Test Chamber, Lab Metal Furniture, and Restaurant Refrigerator. A laboratory oven is a device used to heat or dry materials within a stable temperature control environment. These ovens are used for various purposes in laboratory activities, such as drying samples, sterilizing equipment, testing product stability, or performing other processes that require a specific temperature and a strictly controlled environment. Typically, laboratory ovens are equipped with digital temperature controls and sensors to ensure consistent and accurate temperatures throughout the process. There is a change in the heater model in the natural convection oven so that it is necessary to monitor the temperature to get a consistent temperature in accordance with company specifications.
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    Failure Analysis of Econo Dual Module Frame Installation in The Automatic Frame Assembly Process
    (2025) Stifen Tama Tamba Stifen Tama Tamba; Nakul,Fitriyanti
    In the modern manufacturing era, process automation plays an important role in increasing efficiency and product quality. One of the main components in automation is the Automatic Frame Assembly Process which has a crucial role in installing the frame on the Econo Dual module because it uses robot power to carry out this process, and this certainly follows existing parameter provisions and uses certain programs on the machine. Econo Dual Module is a product resulting from the production of this machine which is used as the object of this research. This research aims to identify the main cause of the high failure rate of frame installation on the Econo Dual module using the Root Cause Analysis (RCA) method and find the solutions to handling the problems. By using a fishbone diagram and 5 Whys analysis, several causes of failure to install the frame on the module were found, including there is no NTC components on the module (which is the main cause and problems that often occur), the presence of bubbles and discontinuity gluing on the module, damaged frame, and solder spatter on the module. After knowing the several causes of the failure, the author found various solutions to minimize the problem according to the provisions of how the problem occurred individually
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    Analysis of Energy Consumption for Cost Saving Efficiency of Electric Energy use at PLN Belakang Padang using Internet of Thinks (IOT) Technology
    (Politeknik Negeri Batam, 2025-01-23) Putri, Ristari Eka; Puspita, Widya Rika
    Electrical energy consumption at PLN Belakang Padang is in the wasteful category, this can be seen from the building which is inefficient and wasteful and the calculation of the intensity energy consumption of 18,19 KWh / m² / month which is included in the wasteful category. the purpose of this study is to upgrade the technology by using an electricity monitoring tool using the technology of thought and the Blynk platform in order to monitor remotely. as well as analyzing energy saving opportunities. the energy saving opportunities carried out are reducing the air conditioner temprature to 24 - 27℃ and reducing the duration of AC 1, 2 PK, and computer usage by 1-2 hours. after implementing for 2 months the intensity energy consumption behind the field became 15,06 KWh/m²/month which fell into the efficient category with an increase in profit of 17%.
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    Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)
    (Politeknik Negeri Batam, 2023-07-11) Permadhi, Dede Gading; Prebianto, Nanta Fakih; ; Wijanarko, Heru
    Non-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.
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    Comparison of Harbest and Master Harness Methode For Analyzing Defect Wire Harness Product on Toyota Alphard 812888-XXX
    (2024-07-23) Prahyoga, Tya Duwi; Duwi Tya Prahyoga; Wivanius,Nadhrah; Nadrah Wivanius
    PT Sumitomo Wiring System Batam Indonesia was a Japanese company that produced wire harnesses in the automotive world, particularly focusing on quality and quantity issues. Quality problems in customers were the most feared by all parties at PT Sumitomo Wiring System Batam Indonesia. Wire harnesses were a combination of several cables commonly used in vehicles and had a function to deliver electric current and signals to the vehicle. This was very reasonable because if, for example, we bought a wiring harness and it turned out that it was not properly installed with a connector, there was no connection of electric current and the car could not work optimally and could lead to accidents. The wire harness production process did not always run as it should. Problems could arise from machine, human, material, and method factors that could cause defects in the products produced. This study aimed to analyze wire harness defects in one of Toyota's products by visual inspection using the Master Harness and Harness Best Engineering System (HBS) methods. Visual inspection using the Master Harness method was to compare the product with a sample wire harness to ensure that the product or other production results matched the predetermined standards. For the Harness Best Engineering System (HBS) checking method, a wire harness drawing that matched the original size was affixed to the board and then compared with the production wire harness that met the predetermined standards. In this case, Pareto diagrams and fishbone diagrams were used to analyze the resulting data. The results of this study showed a significant decrease in defects from 66 to 30 when using the Master Harness and Harness Best Engineering System (HARBEST) method, which indicated a substantial improvement in the quality of wire harness inspection produced.
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    Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process
    (2024-07-02) M,Anjunius; Puspita,Widya Rika
    A Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.
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    Econo Product Quality Analysis
    (2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, Muhammad
    The quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.
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    PERFORMANCE RATE DATA ANALYSIS OF OEE BY DATA RECORD SYSTEM MODIFICATION IN FINAL INSPECTION MACHINE
    (2024-06-14) Firdaus, Muhammad; Prebianto, Nanta Fakih
    The role of machinery is crucial in production to keep it optimized. The capacitor manufacturing process consists of assembly and final inspection. Analysis of the final inspection improvement shows that the decline in machine performance is caused by the repetition of inspection which causes lost time and affects the daily production time. The cause of detection errors is unpredictable and still unknown. This research measures the performance of machines in the manufacturing industry with the Overall Equipment Effectiveness (OEE) method and uses 7QC tools such as fishbone and flow charts. After the project was completed, it was found that the decline in the performance of the final inspection machine was due to a lack of focus in the analysis. The limited data after the final lot made it difficult to determine cameras with high inspection errors because inspection repetition data was not recorded. In this study, data from 10 manual inspection lots on each machine were taken, the average impact of re inspection was 14.1%, and the average performance after re-inspection was 81.6%. Camera 3 has the highest number of defects at 34% and camera 4 at 29%. The higher the number of camera defects, the greater the performance degradation in the inspection process.