D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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  • Repository Politeknik Negeri Batam
    Item
    Analysis Of The Cause Of Not Stick Wedge On Chip on Board
    (2024-07-30) Kurniawan, Ai; Sugandi, Budi
    Abstract- Wedge Bond is one of the bonding methods in the wire bond process. Wedge that does not stick to the leadframe is one of the defects in the Wire Bond process. One of the impacts of this defect is that the chip becomes disconnected from the leadframe, so that RFID products cannot be used because of this defect. The purpose of this research is to find the cause of the defect, because this defect occurs quite often when doing the Wire Bonding process on COB RFID. The method in this research the author uses Fishbone Diagram. Fishbone Diagram consists of several factors, namely Man, Machine, Material, Method, Measurement, and Environment. By using Fishbone Diagram, the author can analyze some of these factors. The author tries to do BrainStorming with several students/parties who have done the Wire Bonding process. After doing BrainStorming, the author will get several possible causes of defects, then verify the possible causes that have been found. The expected result of this research is that the author can find the main cause of the defect. So that in the future a solution can be found so that the defect can be overcome or even avoided. In this research, the cause of the problem in this defect is the Wedge Parameter which is less accurate, so the author adjusts the previous parameter. Keyword: Wedge Bond, COB RFID, Fishbone Diagram
  • Repository Politeknik Negeri Batam
    Item
    Analysis of the effectiveness of implementing internships in Hungary for improvement students
    (2024-03-17) Radha Sellini, Savira; Jefiza, Adlian;
    This study aims to analyze the effectiveness of internships abroad in developing skills, increasing cross-cultural understanding, and its impact on the professional careers of interns. This research involves monitoring and interviewing interns who took part in internship programs abroad during a certain period. The collected data was analyzed to evaluate the benefits of the international internship experience