D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

Browse

Filters

20242

Settings

Subject: search.filters.subject.Materials science

Search Results

Now showing 1 - 2 of 2
  • Repository Politeknik Negeri Batam
    Item
    Analysis of the Needle Pin on the Adapter Dynamikus in KWK 1
    (2024-02-25) Farhan,Reihan Agustino; Maulidiah,Hana Mutialif
    Dynamikus is to check whether the module survives at the specified temperature and test the durability of the module, this research aims to analyze the failure of the needle pin then explain the impact of failure on the module, the causes of module problems, failures in the adapter and module, in this research the author is focused on one of the machines used is the KWK 1 machine, the KWK machine is a machine used to check or test the durability of the module, whether the quality of the module has been tested and the discussion in this analysis is focused on the DYNAMICUS adapter. This discussion concerns failures in the needle module and needle adapter, to understand how to reduce failures in the module and what prevents failure, the causes why. The analytical method used in this research is qualitative analysis, this type of research uses a qualitative descriptive approach that describes and analyzes the problems found. Keywords: Adapter,Dynamikus,Needle Pin
  • Repository Politeknik Negeri Batam
    Item
    ANALYSIS OF BROKEN PIN DEFECT ON MODULE DUAL MC CU IN ENDTEST PROCESS
    (2024-08-08) Saleh, Ihzanuddin; Darmoyono, Aditya Gautama
    Abstract— PIN in semiconductors is an acronym for "Positive-Intrinsic-Negative". This refers to the three-layer structure of some semiconductor components such as PIN diodes, which consists of a positive layer (P), an intrinsic or uncharged layer (I), and a negative layer (N). Pins have a variety of functions, in this case the pin is a component in semiconductors that functions as a connector from one component to another. Broken pins are failures that often occur in the Dual MC Cu module in the EndTest process, almost every load there must be broken pin damage, because this module uses sensitive needle pins compared to pins in other modules. There are several factors that affect broken pins, namely; a few wrong pin testing positions, adapters that are too strong in pressure, and from the previous process. This study was conducted to analyze the factors and prevent damage done to the EndTest process caused by broken pins in order to minimize the damage that occurs. This research uses the Fishbone Method and Pareto Chart. This research can analyze the failure, can find the aspects involved in the main failure, and find the causes of product defects in the EndTest production process.