Jurusan Teknik Elektro

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  • Item
    Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process
    (2024-07-02) M,Anjunius; Puspita,Widya Rika
    A Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.
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    Alat Ukur Kualitas Air dengan Serial Komunikasi RS485 dan CAN Bus
    (Politeknik Negeri Batam, 2024-01-18) Helmalia Putri, Ega; syafei Gozali, Muhammad
    Water is an important factor in supporting life. Factors that need to be considered include the level of turbidity and the acidity, or alkalinity, of the water. This research was carried out to create a design tool that aims to monitor water quality, especially turbidity and acidity or alkalinity, using the SEN0189 turbidity sensor and the E201 pH sensor. The test parameters used in this research are a turbidity sensor type SEN0169 and a pH sensor type E201. RS485 and CAN Bus are used as media to transmit data from sensors. Testing on the turbidity sensor is carried out by testing a sample whose turbidity value is known, namely 1000 NTU. The sample is then tested by taking a 10 ml sample of turbid water and measuring it using a turbidity metre to determine the current value, and then the 10 ml of turbid water is replaced with 10 ml of clear water. to get a comparison value, and carry out repeated measurements until you get clear water with a level of 0 NTU. The pH sensor is tested by measuring a pH sample of 1–14, where if the pH is <7, it is acidic, pH 7 is neutral, and >7 is alkaline. Measurements are carried out with a pH metre to determine the acidity or alkalinity levels. Based on the test results, the turbidity sensor has an error percentage of 0.11% and the pH sensor has an error percentage of 0.13%. The conclusion is that for each reading of the turbidity sensor and pH sensor, it is known that if the turbidity sensor is measuring cloudy water, the resulting output voltage is small, and if it is measuring clear water, the resulting output voltage is high. Meanwhile, when a pH sensor detects an acidic solution, the output voltage produced is high, and vice versa, when the solution is alkaline, the output voltage produced is small.
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    Failure Analysis of IC (Econo) Modules in Dynamic,Static, and ISO Process
    (2024-05-02) Alfath,Ridho Muhammad; Arifin,Muhammad
    Dynamic, Static, and ISO are adapters that are useful for testing modules on the machine. In this system, Dynamic, Static, and ISO have their respective roles in the testing machine with the process of using a KWK 4-type machine. This research aims to analyze the frequent module rejects that occur in dynamic, static, and ISO. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. Keyword: Adapter, ISO, Dynamic, Static
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    Study of Solubility of Ferric Chloride in Etching process
    (2024-07-23) fadhil,muhammad; budiana
    The etching process is the process of removing copper from a PCB with FeCl3 solution by means of automatic spraying. Etching itself aims to remove copper on PCBs that have been coated with dry film or commonly known as the laminating process. To remove copper from PCBs, an etching process must be carried out, this process uses FeCl3 solution as the dissolved material and DI water as the solvent. During the etching process, the FeCl3 solution has its own saturation point. From the problem above, the author made a final assignment entitled "Study of Solubility of Ferric Chloride (FeCl3) in Etching Process" namely by analyzing and conducting experiments on problems that occur in the etching process. With this project, I hope that I can help companies to analyze the problems that occur and to find out the saturation point of etching itself so that it can reduce defects or rejects on PCBs. The method is carried out by conducting experiments using several PCBs with machine parameters (speed, temperature and max flow).