D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process
(2024-07-02) M,Anjunius; Puspita,Widya Rika
A Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.
"Analysis of Terminal Failures in The Econo Dual Module at End Test Process
(0001-07-24) Evan,Antoni; Octowinandi,Vivin
— Econo Dual module is one of the manufactured products that has a good summary of features as high power desity,integrated temperature sensor available and RoHScompliant module,econo Dual also has advantages as compact module concept,optimized customer’s development cycle time and cost,configuration flexibility and econo dual can be applied to motor control and drives,industrial heating and welding,mine work and room air conditioners. But with all its advantages the econo dual module must also go through a final checking process, So that the module made can be used properly and perfectly for customers. Terminals are an important part of the module that serves to connect the electrical circuit system to the electrical circuit where the connection is not complex. And final checking using two methods, namely visual and mechanical checking.For this paper focuses more on checking terminals and errors and defects in the terminal part of the econo dual module.The author makes a final project entitled “ANALYSIS OF TERMINAL FAILURE IN THE ECONO DUAL MODULE AT END TEST PROCESS”, with the purpose of being able to analyze products that are categorized as failures and defects. Keywords: Failure Terminals Econo Dual module, End test process, Checking
Analysis of the Defect's Causes Not Complete Soldering on Reflow Oven Machine using RCA Techniques
(2024-06-24) AMELIA; Nakul,Fitriyanti
The efficiency of the production process against not complete soldering defects encourages the application of Quality by control strategy for semiconductor components in the form of DCB modules as a scientific approach based on the application of quality risk in semiconductor component product development. This article aims to provide knowledge about the root cause analysis method that can be used in risk management for problems that occur in the manufacturing industry. The results of the article review of root cause analysis methods, such as Pareto Analysis, Fishbone Diagram, 5Whys, Failure Mode and Effect Analysis, can be used to find the root cause of a problem with differences in each method in terms of stages, analysis and risk assessment. The benefit of this article is that every company can make improvements to the crucial factors that trigger the not complete soldering defect and prevent and even solve this defect so that the company gets low costs and large profits.
Econo Product Quality Analysis
(2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, Muhammad
The quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.
Failure Analysis of Electric Car Modules: Case Investigation on Econo Pack+B Products in Measurement Testing
(2024-06-03) Dinata Farhan Muhammad; Sani Abdullah
As demand continues to increase, Infineon Technology AG is facing an increase in production orders, which is a positive thing but also brings serious challenges in the process. This study aims to identify problems that arise in production by conducting an in-depth analysis of a crucial component in electric vehicles, The method used to solve the problem by making improvements to product quality testing, by making measurement tools. The results of observations of production defects for 3 months reached 4.72%, so the authors investigated the problem and made improvements to production using measurement tools. So that the results of defect observations using the method have changed Significant, Showing a figure of 0.56% in observations again for 3 months.