D3 Teknik Elektronika Manufaktur
Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759
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Item Analysis of Defect Issues in Wire Bond ASM I Hawk Extreme 099 Before-After Preventive Maintenance(PM)(Politeknik Negeri Batam, 2023-07-11) Permadhi, Dede Gading; Prebianto, Nanta Fakih; ; Wijanarko, HeruNon-stick on pad (NSOP) is a defect that falls under the defect category and is very problematic to the manufacturing process because it can cause the production machine to stop working immediately and prevent the material from being reused or removed. The production schedule was thrown off when NSOP issues appeared. This causes a lot of unplanned downtime and may cause it to exceed the management of the company's recommended range. The IHAWK Extreme 099 ASM machine was studied by the authors utilizing the fishbone method, where the fishbone itself is highly useful in determining the reason of errors that occur besides that the author also uses DOE (Design of Experiment) to find the best parameters use. Find causes of NSOP is the goal of this study, defects on the machine minimize the possibility that NSOP defects will develop on the machine, and increase the machine's output. The results of the research are get 1 good parameter to use in production line, there is use 116 DAC (Digital analog Convert) for the Bond Power Parameters, use 35 gf for the Bond Force Parameter. After this parameters implemented during production running, the number of occurrences of NSOP issues can be reduced to 42%.Item Comparison of Harbest and Master Harness Methode For Analyzing Defect Wire Harness Product on Toyota Alphard 812888-XXX(2024-07-23) Prahyoga, Tya Duwi; Duwi Tya Prahyoga; Wivanius,Nadhrah; Nadrah WivaniusPT Sumitomo Wiring System Batam Indonesia was a Japanese company that produced wire harnesses in the automotive world, particularly focusing on quality and quantity issues. Quality problems in customers were the most feared by all parties at PT Sumitomo Wiring System Batam Indonesia. Wire harnesses were a combination of several cables commonly used in vehicles and had a function to deliver electric current and signals to the vehicle. This was very reasonable because if, for example, we bought a wiring harness and it turned out that it was not properly installed with a connector, there was no connection of electric current and the car could not work optimally and could lead to accidents. The wire harness production process did not always run as it should. Problems could arise from machine, human, material, and method factors that could cause defects in the products produced. This study aimed to analyze wire harness defects in one of Toyota's products by visual inspection using the Master Harness and Harness Best Engineering System (HBS) methods. Visual inspection using the Master Harness method was to compare the product with a sample wire harness to ensure that the product or other production results matched the predetermined standards. For the Harness Best Engineering System (HBS) checking method, a wire harness drawing that matched the original size was affixed to the board and then compared with the production wire harness that met the predetermined standards. In this case, Pareto diagrams and fishbone diagrams were used to analyze the resulting data. The results of this study showed a significant decrease in defects from 66 to 30 when using the Master Harness and Harness Best Engineering System (HARBEST) method, which indicated a substantial improvement in the quality of wire harness inspection produced.Item Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process(2024-07-02) M,Anjunius; Puspita,Widya RikaA Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.Item Econo Product Quality Analysis(2024-05-07) Luaha,Yohanes Melka Jaya; Arifin, MuhammadThe quality of semiconductor products has a big role in supporting the development of modern technology. Econo Products Low and Medium Power modules, Econo Products can helptechnological developments. This research aims to explore the concept of product quality in the context of the semiconductor industry, analyzing the factors that influence quality andcreating good quality results.Item PERFORMANCE RATE DATA ANALYSIS OF OEE BY DATA RECORD SYSTEM MODIFICATION IN FINAL INSPECTION MACHINE(2024-06-14) Firdaus, Muhammad; Prebianto, Nanta FakihThe role of machinery is crucial in production to keep it optimized. The capacitor manufacturing process consists of assembly and final inspection. Analysis of the final inspection improvement shows that the decline in machine performance is caused by the repetition of inspection which causes lost time and affects the daily production time. The cause of detection errors is unpredictable and still unknown. This research measures the performance of machines in the manufacturing industry with the Overall Equipment Effectiveness (OEE) method and uses 7QC tools such as fishbone and flow charts. After the project was completed, it was found that the decline in the performance of the final inspection machine was due to a lack of focus in the analysis. The limited data after the final lot made it difficult to determine cameras with high inspection errors because inspection repetition data was not recorded. In this study, data from 10 manual inspection lots on each machine were taken, the average impact of re inspection was 14.1%, and the average performance after re-inspection was 81.6%. Camera 3 has the highest number of defects at 34% and camera 4 at 29%. The higher the number of camera defects, the greater the performance degradation in the inspection process.Item Analysis of Tear and Service Life on Capillary Process Framebond Machine HK 133(2024-07-06) Fauzan,Muhammad Al; Maulidiah,Hana MutialifThe Capillary Bonding process is an important method in the assembly of semiconductor components that involves joining with the use of adhesive materials. The capillary is one of the main components along with the blade contained in a wire bonding machine system. Wire bonding machine system with a process using the HK-133 type which can affect productivity in the bonding process. Productivity in the bonding process. This study aims to analysis the frequent occurrence of rejects caused by calibration limits which include blade and capillary replacement. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, namely describe and analysis the problems, The research shows that every calibration and capillary limit that has been replaced will have an impact on good results, as well as increase productivity on the machine framebond HK 133.Item Analysis Defect of the Econo PIM 3 Module in the Endtest Process (KWK 4)(2024-06-14) Siregar, Willi Prayogi; Wikanta, PrasajaThe Econo PIM 3 Module is one of the module Processed through KWK 4 Machine in the Endtest Process Area. This module has a defect called Bent Pin and Burn Pin, so this research was prepared to find out the causes of the problems that occur and make improvements to prevent the occurence of these defects.Item SMART TEMPERATURE AND HUMIDITY MONITOR(Politeknik Negeri Batam, 2024-07-03) Isranda, Willy; Nadhrah Wivanius S.Si., M.SiThis paper was offer the new features that can detect, notify, record the humidity and temperature instantaneously in order to have stable, controllable atmospheric conditions. This research was used of temperature humidity sensor DHT-11 to detect level of humidity and temperature changes inside the room. With Comparative analysis of the hardware data with readings from the HTC-2 device revealed minimal total error rates, with an average of 1.594% affirming the reliability and consistent performance of this device. The data and information from DHT-11 sensor was transferred by ESP32 using Arduino IDE Program and analyzed graphically on Google Spreadsheet platform using Apps Script.Item Improvement Yield to Increase Productivity for Model Light-2(2024-08-13) Hermin Iswanto Angga; BudianaProduction yields one of the processes that need to control in manufacturer process to know the productivity of production. Production yield without control will negatively impact productivity and increase production costs. There are several reasons why production yield may not achieve the target, affecting costs due to elements such as Man, Method, Material, Machine, and Environment. To identify and address these issues, we will use the 4M+1E tools and capability statistics to analyze the problems and determine their origins and solutions. According to the analysis results using 4M+1E from the data (summary yield production, log data from the end-tester, component datasheets, schematics, and bench tests), we can identify the root causes of the problems. By comparing the data readings using distribution charts, we can determine the results. Based on the study of the manufacturing process using 4M+1E and capability statistics, it was concluded that the decrease in yield performance was caused by the machine test limit specification. Additionally, changing the machine test limit increased yield productivity, achieving a 99.99% success rate. This change was identified through an ECN and monitored over two months of production.Item Comparative Analysis between SA-516 Gr 70 Material with SA-537 Class 2 Material in Shell Pressure Vessel Fabrication Process(2024-07-31) Putri, Sarah Athaullah Wenna; Puspita, Widya RikaPressure vessel is a container to accommodate or store pressure fluids, both liquid and gas fluids which both have different pressures and temperatures. The pressure on the walls and body of the pressure vessel must be taken seriously, because it complies with applicable international design standards and priority the safety and security of workers. Research was conducted on a pressure vessel that aims to determine whether using the specified temperature affects the thickness of the shell to meet ASME standards. Research on shell components using SA-516 Gr 70 material and SA-537 material. Experiments were carried out with each material at temperatures of 250 C, 235 C, 343 C, where each material and temperature different thickness. The results of this research meet ASME standards because during the trial the thickness of the shell is not less than the actual thickness specified by the drawing. Which each experiment has an average value, namely SA-516 Gr 70 at 250 C with an average value of 13.25 mm, then at a temperature of 235 C the average value is 18.25 mm, at a temperature of 343 C the average value is 22.55 mm. While SA-537 Class 2 at a temperature of 250 C average value of 25.72 mm, at a temperature of 235 C average value of 18.31, at a temperature of 343 C average value of 13.82 mm.