D3 Teknik Elektronika Manufaktur
Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759
Browse
3 results
Search Results
Item Analysis of Lifted Stitch Defect on EconoPack4 Module in Wire Bonding Process(2024-07-02) M,Anjunius; Puspita,Widya RikaA Lifted Stitch Defect is a wire that becomes disconnected or detached from the desired bonding location, typically a bonding pad on an IC (Integrated Circuit) or substrate. This issue presents a persistent challenge in the semiconductor module during the wire bonding process, thereby affecting the quality of semiconductor products. This research employs a structured approach to identify and eliminate these defects. Diagram charts, Data Collection, and Fishbone Diagram analysis are utilized to systematically uncover the root causes and enhance the quality of the semiconductor module. The applied corrective measures resulted in a 96.75% reduction in lifted stitch defects, demonstrating the effectiveness of this methodology. This research can lead to continuous improvements in the wire bonding process, ensuring increased product quality and reliability.Item Failure Analysis of IC (Econo) Modules in Dynamic,Static, and ISO Process(2024-05-02) Alfath,Ridho Muhammad; Arifin,MuhammadDynamic, Static, and ISO are adapters that are useful for testing modules on the machine. In this system, Dynamic, Static, and ISO have their respective roles in the testing machine with the process of using a KWK 4-type machine. This research aims to analyze the frequent module rejects that occur in dynamic, static, and ISO. The analysis method used in this research is qualitative analysis. This type of research uses a qualitative descriptive approach, which describes and analyzes the problems found. Keyword: Adapter, ISO, Dynamic, StaticItem Study of Solubility of Ferric Chloride in Etching process(2024-07-23) fadhil,muhammad; budianaThe etching process is the process of removing copper from a PCB with FeCl3 solution by means of automatic spraying. Etching itself aims to remove copper on PCBs that have been coated with dry film or commonly known as the laminating process. To remove copper from PCBs, an etching process must be carried out, this process uses FeCl3 solution as the dissolved material and DI water as the solvent. During the etching process, the FeCl3 solution has its own saturation point. From the problem above, the author made a final assignment entitled "Study of Solubility of Ferric Chloride (FeCl3) in Etching Process" namely by analyzing and conducting experiments on problems that occur in the etching process. With this project, I hope that I can help companies to analyze the problems that occur and to find out the saturation point of etching itself so that it can reduce defects or rejects on PCBs. The method is carried out by conducting experiments using several PCBs with machine parameters (speed, temperature and max flow).