D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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Analysis of Technical Anomalies in Power Supply AMR Using FMEA at PT. PLN Batam
(2025-08-06) Perdana, Ikhsan; Octowinandi, Vivin
— The Automatic Meter Reading (AMR) system plays a crucial role in the efficient collection of electricity consumption data at PT. PLN Batam. However, the reliability of this system is frequently disrupted by recurring damage to the AMR device's power supply, leading to failures in accurate and real-time data transmission. This study aims to identify the primary failure modes, analyze their root causes, and formulate mitigation strategies to enhance the reliability of the AMR power supply. Through a combination of fishbone analysis, Failure Mode and Effect Analysis (FMEA), visual inspection, and component measurements, it was found that the two most significant failure modes are the continuous operation (24 hours) of the power supply and exposure to high ambient temperatures. The FMEA results showed Risk Priority Numbers (RPN) of 175 for frequency of use and 245 for temperature, highlighting the urgency of addressing both factors. Specifically, visual inspection and capacitance measurements confirmed that the 220uF electrolytic capacitor is the most vulnerable component, exhibiting significant capacitance degradation due to high temperatures and non-stop operation, which leads to unstable output voltage and frequent modem restarts. Based on these findings, the study recommends power supply PCBA rework, specifically replacing the faulty capacitors, as a cost-effective repair solution. Furthermore, as a preventive measure, the implementation of an active cooling system within the PLN APP box and the use of an external timer to regulate the operational cycle of the power supply and modem are proposed. Although the preventive recommendations have not yet been implemented due to cost and time constraints, this research provides a deep understanding of the root causes of AMR power supply issues and offers practical solutions to improve system performance and customer satisfaction at PT. PLN Batam.
Effect of Time and Temperature on the Quality of Stator Connectivity in the Dip Soldering Process of Electric Toothbrush Products
(2025) Rizky Fahreza Hasibuan Rizky Fahreza Hasibuan; Wivanius, Nadhrah; Wivanius,Nadrah
In the development of electronic component production, the mechanical quality of electronic component assembly is an important part to estimate the overall quality of electronic equipment, especially for electric toothbrush products. The performance, dependability and durability of an electric toothbrush are directly affected by the connectivity of the stator, making it a critical component in the manufacturing process. Solder dipping is an important step in guaranteeing good connectivity. The process involves dipping the metal contacts into solder tin to create a strong electrical connection. The temperature and duration of the dipping process are crucial factors that significantly affect the quality of the final product. Lack of solder penetration or component damage due to overheating can result from inappropriate temperatures or time periods. To determine the ideal parameters, tests were conducted using anova methodology on several stator samples. The optimal parameter combination was found at 380 °C with a dipping duration of 4 seconds, which provided complete solder penetration, strong mechanical bonding, and no observable thermal damage to the stator components. Lower temperatures tended to cause incomplete soldering, while higher temperatures or longer dipping times increased the risk of overheating and deformation. The findings from this study can be used as a guide by the electronics sector to optimize soldering procedures and improve the caliber and longevity of its products.
Design and Implementation RF High Power and Efficiency Amplifier GaN HEMT with Class E Switching Topology for Wireless Power Transfer
(2025-08-12) Hutapea, Piter Wijaya; Alam, Basuki Rachmatul
This paper presents the design and implementation of a high-efficiency Class E High-Power Amplifier (HPA) for wireless power transfer applications at 2.6 GHz. Utilizing GaN HEMT technology, the amplifier achieves exceptional performance through optimized switch-mode operation and advanced impedance matching techniques. The design process incorporates c simulations including DC IV characterization, stability analysis, and load-pull optimization to determine the optimal operating parameters. Class E Implementation with Transmission Line employing λ/8 and λ/12 transmission line stubs ensures minimal reflections, with measured return losses below -33 dB. The implemented design demonstrates outstanding efficiency, reaching 81.57% power-added efficiency (PAE) and 86.48% drain efficiency (DE) in simulations, while maintaining 277.7 W output power. Practical measurements validate the design's performance, showing 16 dB gain and stable operation. The compact PCB implementation on Rogers Duroid 5880 substrate (104.4 × 68.5 mm) confirms the feasibility of the design. This work significantly advances the state-of-the-art in high-efficiency RF power amplification, particularly for wireless power transfer systems where energy efficiency is paramount. The results demonstrate the potential of Class E GaN-based amplifiers to enable efficient, high-power wireless energy transmission, with important implications for applications ranging from electric vehicle charging to remote power delivery systems.
Improving Maintenance Efficiency of AMCOTEC Welding Machines through Comprehensible Schematic Design for Novice Technicians
(2025-09-10) HARYANTO, SIGIT; Pupista, Widya Rika
Abstract-This research aims to redesign the schematic structure of the AMCOTEC welding machine to facilitate the repair and maintenance process by novice technicians. The approach used includes analyzing the needs of novice technicians , identifying areas that often experience damage, and training novice technicians to more easily understand the schematics that are being made. By integrating a simpler interface, clear visualization of components, and easier access to important parts of the machine, it is hoped that novice technicians can quickly understand and solve problems that arise on welding machines. The results of this design are expected to increase the efficiency of maintenance time, reduce repair errors, and improve the skills of novice technicians in operating and maintaining AMCOTEC welding machines. The designed scheme significantly makes it easier for technicians to repair and maintain welding machines. In addition, the training program held proved to be very beneficial for novice technicians, resulting in a significant time reduction of 40.93% in the work process.
Improving the Laser Marking Process to Reduce Defects
(2025-04-25) Torik Muhammad; Arifin Muhammad
In the world of manufacturing, laser marking has been very widely used, because of its advantages compared to other marking processes. The laser marking process is one of the most widely used non-contact marking methods in the industry because of its high speed and precision. There are several types of laser marking on the market but what is discussed here is fiber laser marking. Fiber Laser Marking Machine is an industrial equipment used to print and mark various types of materials with good beam quality. The marking process uses non-thermal technology that generates high-intensity waves using fiber optic cables. This machine can mark metal materials and some other non-metal materials. However, the quality of marking is often affected by various factors that cause defects, namely Man, Machine, Environment, Methode, Measurenment and Material. This research focuses on reducing defects in the laser marking process by identifying common types of defects found such as yellowish, laser slant, blurr, double layer, NG laser. The methodology used includes analysis with optimized process parameters using the application of process statistical controls. The results of the study are expected to show a significant decrease in the level of defects through the implementation carried out. The study provides practical recommendations for the industry to reduce defects in the laser marking process and improve overall production efficiency.
Monitoring pH Sensor with Temperature Compensation using MCU 32-bit Equipped with RS-485 Communication Module
(2025-08-08) Santo Mykolardo Sidabutar; Oktowinandi, Vivin
This study discusses the application of an automatic temperature compensation (ATC) system on pH sensors to improve accuracy to 0.01 pH. The analog values (mV) of pH solutions are very low and susceptible to interference and temperature fluctuations, so an independent pH module was developed with a differential sensor, a DC-to-DC isolator module, and an Op-Amp module as a buffer to stabilize the analog signal. The gradient method was used to manage the slope between temperature and pH, and the ATC formula from Hanna Instruments was applied for temperature compensation. Test results show that pH shifts occur every time the solution temperature decreases, and ATC is able to correct pH measurements. However, the target accuracy of 0.01 pH has not been achieved due to differences in calculation results between manual calculations and the microcontroller. The measurement error percentage of the microcontroller is 0.6%, resulting in an accuracy percentage of 99.4%.
Analysis of PCB Defects in the Reflow Soldering Process Using the PFMEA Method
(2025-04-25) Tanto Wijaya; Muhammad Arifin
Abstract— This research analyzes errors in the reflow soldering process on Surface Mount Technology (SMT) with PFMEA method that often result in defects on printed circuit boards (PCB), such as tombstoning and bridging which can reduce production quality. The defects are caused by several factors, namely unstable temperature profile parameters, uneven use of solder paste, suboptimal stencil design, use of too much solder paste. Preventive solutions were implemented, including solder oven reflow calibration, squeegee function with good pressure when printing solder paste, optimal opening design, stencil mold volume. Monitoring results showed that these corrective actions reduced the production reject rate from 6.46% to 2.52% indicating the effectiveness of the measures taken. Keyword: PCB Component Defects, Reflow Soldering Process, Process Failure Mode and Effects Analysis (PFMEA).
Counter Based Electrode Cleaning to Avoid Sparking Issue that Causes Delay (Speed Loss)
(2025-08-04) Ramadhan, Caesar Syahru Ramadhan; Maulidiah, Hana Mutialif
Wire Bond is one of the most important processes in the IC manufacturing stage, this process aims to create an electrical connection between the die and the lead frame using a thin wire, one of the critical steps in this process is the Electronic Flame Off (EFO). Electrode Flame-Off (EFO) is a controlled process where the thin wire on the capillary (Tail) is heated using high current pulses that generate intense heat through the Torch Electrode. These pulses generate intense heat through the Torch Electrode, which melts the tip of the Tail. This melt form a small ball of molten metal called the Free Air Ball (FAB). The high current pulse applied to the wire causes the wire tip to melt and then solidify, creating a buildup. This buildup leads to spark faults/failures, which results in decreased UPH (units per hour) and reduced OEE (overall equipment effectiveness) due to high speed loss, the current cleaning method requires removing the Torch Electrode from the Nozzle, the Torch Electrode is only cleaned when there are severe sparking problems. When that happens, there's a lot of buildup on the Torch Electrode, which makes cleaning take longer. Sometimes, the buildup hardens so much that it can damage the Torch Electrode when it is removed. In such cases, the Torch Electrode needs to be replaced. The author used the PDCA approach method to test a cleaning method that was expected to be efficient. The author also monitored the methods to determine the best frequency. This led to the decision to clean without removing the Troch Electrode from the Nozzle follow the set time. By implementing this project, it is hoped that an efficient Torch Electrode cleaning method and proper frequency definition can prevent Spark problems.
Solder Spatter Defect Analysis
(Alisa Rahmawati, 2025-01-03) Rahmawati Alisa; Arifin Muhammad
The soldering system process is a soldering process where chip components are melted by high temperature hot air to form a reflow temperature change process, thus forming a module which is then cooled together. During the soldering process, some scrap often occurs, one of which is solder spatter. The aim of this final assignment is to analyze how often solder spatter occurs on products. In this research I used the flow chart, data collection to determine how many scrap solder spatters are in the soldering system process.
Analysis Of Pin Needle Adapter Dynamics In The IGBT Module Endtest Process
(2024-06-29) Mufriki,Achmad; Octowinandi,Vivin
Needle Pin is a needle located on the dynamic adapter and functions to provide voltage to the IGBT module pins during the Endtest process. Many testing processes are not completed on time because some processes do not run according to schedule, especially in the Endtest process due to delays which result in long downtime, one of which is due to problems with testing dynamics. Damage to the dynamic adapter is mainly burnt and jammed needle pins. The author uses the fishbone method/Ishikawa diagram to find out the factors and root causes that cause burnt needle pins. The main root cause in this research is contaminated pins module. This research found that the value of P1 The average machine downtime before repair was 68.83 minutes, min 30 minutes and maximum 115 minutes and the percentage was 71.69%. And the value of P2 The average machine downtime after repairs was 55.08 minutes and the min was 20 minutes and the maximum was 85 minutes and the percentage was 57.37%. Based on the matrix, the comparison range for P1 and P2 is 14.32%.

D3 Teknik Elektronika Manufaktur

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