D3 Teknik Elektronika Manufaktur

Permanent URI for this collectionhttps://repository.polibatam.ac.id/handle/PL029/1759

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Subject: search.filters.subject.Statistics, computer and systems science

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  • Repository Politeknik Negeri Batam
    Item
    SMART TEMPERATURE AND HUMIDITY MONITOR
    (Politeknik Negeri Batam, 2024-07-03) Isranda, Willy; Nadhrah Wivanius S.Si., M.Si
    This paper was offer the new features that can detect, notify, record the humidity and temperature instantaneously in order to have stable, controllable atmospheric conditions. This research was used of temperature humidity sensor DHT-11 to detect level of humidity and temperature changes inside the room. With Comparative analysis of the hardware data with readings from the HTC-2 device revealed minimal total error rates, with an average of 1.594% affirming the reliability and consistent performance of this device. The data and information from DHT-11 sensor was transferred by ESP32 using Arduino IDE Program and analyzed graphically on Google Spreadsheet platform using Apps Script.
  • Repository Politeknik Negeri Batam
    Item
    Scrap Analysis on Econo Pim 3 Module
    (2024-06-24) Sitompul, Stephen; Nakul, Fitriyanti
    Econo pim 3 module is one of the manufactured products that has a good summary of features as highs power density, integrated temperature sensor available and RoHS- compliant module. Econo pim 3 module also has advantages as compact module concept, optimized customers development cycle time and cost, configuration flexibility and econo pim 3 module can be applied to motor control and drives, industrial heating and welding and room air conditioners. But with all that advantages econo pim 3 module must go through a long process, during the manufacturing process the module is found scrap or not suitable to use, from many manufacturing process system soldering process is bottle neck of scrap found. The purpose of this research is to find the root cause of econo pim 3 module defects during system soldering process and to analysis defects that occur. This research uses the fishbone diagram method, which fishbone diagram is certainly carried help full in knowing the cause of the defects occurs. Fishbone diagram, also called as ‘cause-and-effect’ diagram, is a tool used to identify the root cause of problems which represents the effect and the factors or causes influencing it. [1] Keywords: Defects, Pim 3 Module, System Soldering Process, Fishbone diagram
  • Repository Politeknik Negeri Batam
    Item
    Optimization of IC 32 QFP Pick Up Parameters
    (2024-07-31) Sitompul, Adravia Lisbeth Claudia; Wikanta, Prasaja
    In the pick and place machine with the SM421 model located at TFME (Teaching Factory Manufactur Electronic), until now there has not been an optimal size and parameters for 32 QFP IC components. So that when using the IC 32 QFP component, the machine user must first update or change the component size and determine the parameters. This will take a long time. In its own concept, the purpose of using a pick and place machine in the SMT process is to pick and place small components onto the PCB pad quickly and accurately (without offset). The purpose of this optimization is to shorten the process time when using 32 QFP IC components on a pick and place machine. In optimizing this machine, the DOE method is carried out by experimenting with several parameters and then comparing the results of each combination. The results of this study are based on a small offset and the offset value does not exceed the class 3 standard. So based on the experiments that have been carried out, the optimal parameters are in combination 2 with a pick up delay time of 50s and using soft touch (mount).